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update_PCB4
OSHW-DEIMOS/HARDWARE/A64-TERES/TERES-PCB4-PWR-BTN/Rev.A/PCB4-PWR-BTN_Rev.A.kicad_pcb
Jacob Hrbek 31bf8f2268
PCB4_PWR_BTN_A: Update KiCAD and docs 
* Updated on KiCAD 6.0.3
* Added Stack-up table and graphics
* Added General Notes to the gerber
* Replaced BOM with generated one
* Added README using export from gerber
2022-09-16 05:04:15 +02:00

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(title "Power Button for TERES-1")
(date "31-03-2018")
(rev "A")
(company "OLIMEX, Ltd.")
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(gr_text "1. FABRICATE PER ANSI/IPC-A-600.IPC-QE-605.IPC-4552\n AND IPC-SM-840 SPECIFICATIONS.\n2. USE ROHS-COMPLIANT MATERIALS.\n3. SOLDERMASK BOTH SIDES OF THE BOARD OVER BARE\n COPPER WITH MATERIALS PER ANSI/IPC-SM-840.\n4. SEE FABRICATION FILES WITH SAME TITLE OR DRAWING,\n AND REVISION, AS THIS DRAWING\n5. APPLY SILKSCREEN TO BOTH SIDES OF THE BOARD\n USING NON-CONDUCTIVE EPOXY INK\n6. SEE SEPARATE DRILL FILE FOR HOLE LOCATIONS\n\nRecommended colors:\n - Solder Mask: Red\n - Silkscreen: White (expected to be clearly \n readable on solder mask)\n - Base Material: Neutral\n\nMaterials:\na. Base material Laminated Epoxy Glass FR-4 \n with copper traces\n - TG 150-160 to TG 170-180 recommended\n - Recommended copper thickness 0.6 to 1.6mm\n - Min track spacing 3/3mil\n - Hole size: 2.2mm +/- 0.25mm\n - Thickness per stack-up table\n - No edge connector\n - Surface finish: HASL lead free\nb. Base material alluminium (untested)\n - 1 layer\n - Copper layer both top and bottom\n - Soldermask both sides\n - Thermal conductivity: 1.0W/(m*K) to +3.0W/(m*k)\n - Thickness: 0.3 to 1.6mm\n - Min track spacing: 4/4mil\n - No edge connector\n - Surface Finish any of HASL lead free, ENIG, EPIG, Ag\n - Finished copper: 1 oz Cu" (at 175.26 96.52) (layer "Cmts.User") (tstamp b88e3b8e-0640-491c-bd02-1ea9baeaa975)
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ef586e9e-7537-474e-b32b-9f0c5a2b9975
f299707f-77bb-489f-817a-2d4dfb77fe18
f4d35db5-157f-411c-b740-80299bb34015
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f7219624-0fec-403f-8879-2e50eefc93b2
f9f85bae-5423-4c70-b726-b6d5c8aa2b8e
fb712869-cf6b-479b-9f9a-d44497fa919c
)
)
)
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