33 lines
1.9 KiB
Plaintext
33 lines
1.9 KiB
Plaintext
(module OLIMEX_Devices-FP:SLP2510P8 (layer F.Cu) (tedit 58218DA6)
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(attr smd)
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(fp_text reference U15 (at 0 -2.159) (layer F.SilkS)
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(effects (font (size 0.635 0.635) (thickness 0.15875)))
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)
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(fp_text value "RCLAMP0524P(SLP2510P8)" (at 0 2.6416) (layer F.Fab)
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(effects (font (size 1.27 1.27) (thickness 0.254)))
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)
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(fp_line (start 1.32334 0.49784) (end 1.32334 -0.49784) (layer F.SilkS) (width 0.2032))
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(fp_line (start -1.32334 0.49784) (end -1.32334 -0.49784) (layer F.SilkS) (width 0.2032))
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(fp_circle (center -0.9906 1.27) (end -0.7366 1.27) (layer F.SilkS) (width 0.2032))
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(pad 10 smd rect (at -1 -0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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(pad 9 smd rect (at -0.5 -0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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(pad 8 smd rect (at 0 -0.3875) (size 0.4 0.775) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508))
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(pad 7 smd rect (at 0.5 -0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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(pad 6 smd rect (at 1 -0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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(pad 5 smd rect (at 1 0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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(pad 4 smd rect (at 0.5 0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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(pad 3 smd rect (at 0 0.3875) (size 0.4 0.775) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508))
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(pad 2 smd rect (at -0.5 0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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(pad 1 smd rect (at -1 0.4375) (size 0.2 0.675) (layers F.Cu F.Paste F.Mask)
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(solder_mask_margin 0.0508) (solder_paste_margin 0.01))
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)
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