OSHW-DEIMOS/HARDWARE/A64-TERES/TERES-PCB1-A64-MAIN/Rev.B/TERES.pretty/BATCONN-TERES.kicad_mod
2018-05-30 18:07:46 -07:00

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(module OLIMEX_Connectors-FP:BATCONN-TERES locked (layer F.Cu) (tedit 58218932)
(fp_text reference BATTERY1 (at 9.142 3.76) (layer F.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.254)))
)
(fp_text value BATTCON (at -1.1 7.8) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text user "+ T -" (at -0.15 -4) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 8.2 -2.75) (end -8.2 -2.75) (layer F.Fab) (width 0.254))
(fp_line (start -8.2 -2.75) (end -8.2 2.75) (layer F.Fab) (width 0.254))
(fp_line (start -8.2 2.75) (end 8.2 2.75) (layer F.Fab) (width 0.254))
(fp_line (start 8.2 2.75) (end 8.2 -2.75) (layer F.Fab) (width 0.254))
(fp_line (start 8.2 2.8) (end 5.7 2.8) (layer F.SilkS) (width 0.254))
(fp_line (start 8.2 1.2) (end 8.2 2.8) (layer F.SilkS) (width 0.254))
(fp_line (start -8.2 2.8) (end -5.7 2.8) (layer F.SilkS) (width 0.254))
(fp_line (start -8.2 1.2) (end -8.2 2.8) (layer F.SilkS) (width 0.254))
(fp_line (start 6.7 -2.8) (end -6.7 -2.8) (layer F.SilkS) (width 0.254))
(pad 0 smd rect (at -8.1 -1.2 180) (size 2.2 3.9) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 0 smd rect (at 8.1 -1.2 180) (size 2.2 3.9) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 1 smd rect (at -5 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 2 smd rect (at -3.75 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 3 smd rect (at -2.5 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 4 smd rect (at -1.25 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 5 smd rect (at 0 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 6 smd rect (at 1.25 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 7 smd rect (at 2.5 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 8 smd rect (at 3.75 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 9 smd rect (at 5 3.75 180) (size 0.625 2) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
)