OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_IC-FP.pretty/SSOP24.kicad_mod
2018-05-30 18:14:28 -07:00

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(module SSOP24 (layer F.Cu) (tedit 56C2E532)
(attr smd)
(fp_text reference U* (at -3.175 5.715) (layer F.SilkS)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text value SSOP24 (at 0 -1.27) (layer F.Fab)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text user SSOP24 (at 0 0) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.25)))
)
(fp_line (start -4.565 -2.35) (end -4.565 1.5) (layer F.SilkS) (width 0.254))
(fp_line (start -4.565 1.5) (end -3.715 2.35) (layer F.SilkS) (width 0.254))
(fp_line (start -3.715 2.35) (end 4.435 2.35) (layer F.SilkS) (width 0.254))
(fp_line (start 4.435 -2.35) (end 4.435 2.35) (layer F.SilkS) (width 0.254))
(fp_circle (center -4.7 2.7) (end -4.2 2.7) (layer F.SilkS) (width 0.254))
(fp_circle (center -3.5 1.2) (end -3 1.2) (layer F.SilkS) (width 0.254))
(fp_line (start -4.565 -2.35) (end 4.435 -2.35) (layer F.SilkS) (width 0.254))
(pad 13 smd rect (at 3.56 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 14 smd rect (at 2.91 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 15 smd rect (at 2.26 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 16 smd rect (at 1.61 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 17 smd rect (at 0.96 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 18 smd rect (at 0.31 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 19 smd rect (at -0.34 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 20 smd rect (at -0.99 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 21 smd rect (at -1.64 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 22 smd rect (at -2.29 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 23 smd rect (at -2.94 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 24 smd rect (at -3.59 -3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 1 smd rect (at -3.59 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 2 smd rect (at -2.94 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 3 smd rect (at -2.29 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 4 smd rect (at -1.64 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 5 smd rect (at -0.99 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 6 smd rect (at -0.34 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 7 smd rect (at 0.31 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 8 smd rect (at 0.96 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 9 smd rect (at 1.61 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 10 smd rect (at 2.26 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 11 smd rect (at 2.91 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 12 smd rect (at 3.56 3.525) (size 0.35 1.75) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
)