OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_IC-FP.pretty/SOIC-16_300mil.kicad_mod
2018-05-30 18:14:28 -07:00

52 lines
2.7 KiB
Plaintext

(module SOIC-16_300mil locked (layer F.Cu) (tedit 575F9920)
(attr smd)
(fp_text reference U? (at -3.81 6.985) (layer F.SilkS)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text value SOIC-16_300mil (at 0 -1.905) (layer F.Fab)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text user SOIC-16 (at 0.635 0) (layer F.SilkS)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_arc (start -5.08 0) (end -5.08 -0.635) (angle 90) (layer F.SilkS) (width 0.254))
(fp_arc (start -5.08 0) (end -4.445 0) (angle 90) (layer F.SilkS) (width 0.254))
(fp_circle (center -5.9944 4.445) (end -5.9944 3.81) (layer F.SilkS) (width 0.254))
(fp_line (start -5.08 3.175) (end -5.08 -3.175) (layer F.SilkS) (width 0.254))
(fp_line (start -5.08 -3.175) (end 5.08 -3.175) (layer F.SilkS) (width 0.254))
(fp_line (start 5.08 -3.175) (end 5.08 3.175) (layer F.SilkS) (width 0.254))
(fp_line (start 5.08 3.175) (end -5.08 3.175) (layer F.SilkS) (width 0.254))
(pad 1 smd rect (at -4.445 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 2 smd rect (at -3.175 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 3 smd rect (at -1.905 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 4 smd rect (at -0.635 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 5 smd rect (at 0.635 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 6 smd rect (at 1.905 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 7 smd rect (at 3.175 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 8 smd rect (at 4.445 4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 9 smd rect (at 4.445 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 10 smd rect (at 3.175 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 11 smd rect (at 1.905 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 12 smd rect (at 0.635 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 13 smd rect (at -0.635 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 14 smd rect (at -1.905 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 15 smd rect (at -3.175 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 16 smd rect (at -4.445 -4.7 90) (size 2 0.6) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
)