OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_IC-FP.pretty/14_TDFN-EP.kicad_mod
2018-05-30 18:14:28 -07:00

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(module 14_TDFN-EP (layer F.Cu) (tedit 5885EACE)
(fp_text reference U1 (at 0.042 -2.794) (layer F.SilkS)
(effects (font (size 0.8 0.8) (thickness 0.15)))
)
(fp_text value MAX9814 (at 0 -3.7) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.5 1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 -1.5) (end -1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.6 -1.6) (end -1.6 1.6) (layer F.SilkS) (width 0.1))
(fp_line (start 1.6 -1.6) (end 1.6 1.6) (layer F.SilkS) (width 0.1))
(fp_circle (center -1.8 1.7) (end -1.8 1.8) (layer F.SilkS) (width 0.1))
(pad 0 smd rect (at 0 0) (size 2.3 1.7) (layers F.Cu F.Mask))
(pad 0 smd rect (at -0.55 -0.4) (size 1 0.75) (layers F.Cu F.Paste))
(pad 0 smd rect (at 0.55 -0.4) (size 1 0.75) (layers F.Cu F.Paste))
(pad 0 smd rect (at 0.55 0.4) (size 1 0.75) (layers F.Cu F.Paste))
(pad 0 smd rect (at -0.55 0.4) (size 1 0.75) (layers F.Cu F.Paste))
(pad 1 smd rect (at -1.2 1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 2 smd rect (at -0.8 1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 3 smd rect (at -0.4 1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 4 smd rect (at 0 1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 5 smd rect (at 0.4 1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 6 smd rect (at 0.8 1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 7 smd rect (at 1.2 1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 8 smd rect (at 1.2 -1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 9 smd rect (at 0.8 -1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 10 smd rect (at 0.4 -1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 11 smd rect (at 0 -1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 12 smd rect (at -0.4 -1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 13 smd rect (at -0.8 -1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
(pad 14 smd rect (at -1.2 -1.5) (size 0.2 0.8) (layers F.Cu F.Paste F.Mask)
(solder_paste_margin 0.0055))
)