OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_Connectors-FP.pretty/IDC4M.kicad_mod
2018-05-30 18:14:28 -07:00

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(module IDC4M (layer F.Cu) (tedit 585A369F)
(attr smd)
(fp_text reference CONN? (at 0.127 4.953) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value IDC4M (at 0 3.556) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 2.54 2.54) (end 2.54 -2.54) (layer F.Fab) (width 0.1))
(fp_line (start 2.54 -2.54) (end 0.127 -2.54) (layer F.Fab) (width 0.1))
(fp_line (start 0.127 -2.54) (end 0.127 2.54) (layer F.Fab) (width 0.1))
(fp_line (start 0.127 2.54) (end 2.54 2.54) (layer F.Fab) (width 0.1))
(fp_line (start 0.127 -1.651) (end -5.842 -1.651) (layer F.Fab) (width 0.1))
(fp_line (start -5.842 -1.651) (end -5.842 -0.889) (layer F.Fab) (width 0.1))
(fp_line (start -5.842 -0.889) (end 0.127 -0.889) (layer F.Fab) (width 0.1))
(fp_line (start -5.842 1.651) (end 0.127 1.651) (layer F.Fab) (width 0.1))
(fp_line (start 0.127 0.889) (end -5.842 0.889) (layer F.Fab) (width 0.1))
(fp_line (start -5.842 0.889) (end -5.842 1.651) (layer F.Fab) (width 0.1))
(pad 2 smd rect (at 5.08 -1.27) (size 5.08 1.524) (layers F.Cu F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 1 smd rect (at 5.08 -1.27) (size 5.08 1.524) (layers B.Cu B.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 4 smd rect (at 5.08 1.27) (size 5.08 1.524) (layers F.Cu F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 3 smd rect (at 5.08 1.27) (size 5.08 1.524) (layers B.Cu B.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
)