OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_Connectors-FP.pretty/ICSP-WU06S.kicad_mod
2018-05-30 18:14:28 -07:00

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(module ICSP-WU06S (layer F.Cu) (tedit 56039BC5)
(attr smd)
(fp_text reference ICSP1 (at -0.140001 5.42) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value CONN_01X06 (at 0.08 -7.74) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -4.85 -1) (end 4.85 -1) (layer F.SilkS) (width 0.15))
(fp_line (start 4.85 -1) (end 4.85 2.4) (layer F.SilkS) (width 0.15))
(fp_line (start 4.85 2.4) (end -4.85 2.4) (layer F.SilkS) (width 0.15))
(fp_line (start -4.85 2.4) (end -4.85 -1) (layer F.SilkS) (width 0.15))
(pad 1 thru_hole oval (at -3.125 0) (size 1 1.3) (drill 0.6) (layers *.Cu *.Mask))
(pad 2 thru_hole oval (at -1.875 0) (size 1 1.3) (drill 0.6) (layers *.Cu *.Mask))
(pad 3 thru_hole oval (at -0.625 0) (size 1 1.3) (drill 0.6) (layers *.Cu *.Mask))
(pad 4 thru_hole oval (at 0.625 0) (size 1 1.3) (drill 0.6) (layers *.Cu *.Mask))
(pad 5 thru_hole oval (at 1.875 0) (size 1 1.3) (drill 0.6) (layers *.Cu *.Mask))
(pad 6 thru_hole oval (at 3.125 0) (size 1 1.3) (drill 0.6) (layers *.Cu *.Mask))
)