OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_IC-FP.pretty/SSOP28.kicad_mod
2018-05-30 18:14:28 -07:00

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(module SSOP28 (layer F.Cu) (tedit 57691B27)
(attr smd)
(fp_text reference REF** (at 0.42 17.37) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SSOP28 (at -0.14 -20.85) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_circle (center -3.9 -5.3) (end -3.7 -5.25) (layer F.SilkS) (width 0.15))
(fp_line (start -2.8 -5.25) (end 2.8 -5.25) (layer F.SilkS) (width 0.15))
(fp_line (start 2.8 -5.25) (end 2.8 5.25) (layer F.SilkS) (width 0.15))
(fp_line (start 2.8 5.25) (end -2.8 5.25) (layer F.SilkS) (width 0.15))
(fp_line (start -2.8 5.25) (end -2.8 -5.25) (layer F.SilkS) (width 0.15))
(fp_line (start -2.65 5.1) (end 2.65 5.1) (layer F.Fab) (width 0.15))
(fp_line (start 2.65 5.1) (end 2.65 -5.1) (layer F.Fab) (width 0.15))
(fp_line (start 2.65 -5.1) (end -2.65 -5.1) (layer F.Fab) (width 0.15))
(fp_line (start -2.65 -5.1) (end -2.65 5.1) (layer F.Fab) (width 0.15))
(pad 1 smd rect (at -3.9 -4.225) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 2 smd rect (at -3.9 -3.575) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 3 smd rect (at -3.9 -2.925) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 4 smd rect (at -3.9 -2.275) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 5 smd rect (at -3.9 -1.625) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 6 smd rect (at -3.9 -0.975) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 7 smd rect (at -3.9 -0.325) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 8 smd rect (at -3.9 0.325) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 9 smd rect (at -3.9 0.975) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 10 smd rect (at -3.9 1.625) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 11 smd rect (at -3.9 2.275) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 12 smd rect (at -3.9 2.925) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 13 smd rect (at -3.9 3.575) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 14 smd rect (at -3.9 4.225) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 15 smd rect (at 3.9 4.225) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 16 smd rect (at 3.9 3.575) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 17 smd rect (at 3.9 2.925) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 18 smd rect (at 3.9 2.275) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 19 smd rect (at 3.9 1.625) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 20 smd rect (at 3.9 0.975) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 21 smd rect (at 3.9 0.325) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 22 smd rect (at 3.9 -0.325) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 23 smd rect (at 3.9 -0.975) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 24 smd rect (at 3.9 -1.625) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 25 smd rect (at 3.9 -2.275) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 26 smd rect (at 3.9 -2.925) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 27 smd rect (at 3.9 -3.575) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
(pad 28 smd rect (at 3.9 -4.225) (size 1.6 0.325) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508))
)