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OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_IC-FP.pretty/LQFP48.kicad_mod
JC Staudt f1f9515656 Moved old/KiCAD* -> KiCad/*.old
2018-05-30 18:14:28 -07:00

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(module LQFP48 (layer F.Cu) (tedit 5645CFCB)
(descr "LQFP48 - 48 PIN LOW-PROFILE QUAD FLAT PACKAGE")
(tags "LQFP48 - 48 PIN LOW-PROFILE QUAD FLAT PACKAGE")
(attr smd)
(fp_text reference U (at -2.54 6.35) (layer F.SilkS)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text value LQFP48 (at 0 -6.35) (layer F.Fab)
(effects (font (size 1.27 1.27) (thickness 0.254)))
)
(fp_text user LQFP48 (at 0 0) (layer F.SilkS)
(effects (font (size 1.016 1.016) (thickness 0.254)))
)
(fp_line (start -3.25 2.75) (end -2.75 3.25) (layer F.SilkS) (width 0.254))
(fp_line (start -2.75 3.25) (end 3.25 3.25) (layer F.SilkS) (width 0.254))
(fp_line (start 3.25 3.25) (end 3.25 -3.25) (layer F.SilkS) (width 0.254))
(fp_line (start 3.25 -3.25) (end -3.25 -3.25) (layer F.SilkS) (width 0.254))
(fp_line (start -3.25 -3.25) (end -3.25 2.75) (layer F.SilkS) (width 0.254))
(fp_circle (center -2.5 2.5) (end -2.67462 2.67462) (layer F.SilkS) (width 0.254))
(fp_circle (center -4 4) (end -4.17322 4.17322) (layer F.SilkS) (width 0.254))
(pad 1 smd rect (at -2.75 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 2 smd rect (at -2.25 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 3 smd rect (at -1.75 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 4 smd rect (at -1.25 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 5 smd rect (at -0.75 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 6 smd rect (at -0.25 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 7 smd rect (at 0.25 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 8 smd rect (at 0.75 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 9 smd rect (at 1.25 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 10 smd rect (at 1.75 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 11 smd rect (at 2.25 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 12 smd rect (at 2.75 4.3 90) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 13 smd rect (at 4.3 2.75 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 14 smd rect (at 4.3 2.25 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 15 smd rect (at 4.3 1.75 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 16 smd rect (at 4.3 1.25 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 17 smd rect (at 4.3 0.75 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 18 smd rect (at 4.3 0.25 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 19 smd rect (at 4.3 -0.25 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 20 smd rect (at 4.3 -0.75 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 21 smd rect (at 4.3 -1.25 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 22 smd rect (at 4.3 -1.75 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 23 smd rect (at 4.3 -2.25 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 24 smd rect (at 4.3 -2.75 180) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 25 smd rect (at 2.75 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 26 smd rect (at 2.25 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 27 smd rect (at 1.75 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 28 smd rect (at 1.25 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 29 smd rect (at 0.75 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 30 smd rect (at 0.25 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 31 smd rect (at -0.25 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 32 smd rect (at -0.75 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 33 smd rect (at -1.25 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 34 smd rect (at -1.75 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 35 smd rect (at -2.25 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 36 smd rect (at -2.75 -4.3 270) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 37 smd rect (at -4.3 -2.75) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 38 smd rect (at -4.3 -2.25) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 39 smd rect (at -4.3 -1.75) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 40 smd rect (at -4.3 -1.25) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 41 smd rect (at -4.3 -0.75) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 42 smd rect (at -4.3 -0.25) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 43 smd rect (at -4.3 0.25) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 44 smd rect (at -4.3 0.75) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 45 smd rect (at -4.3 1.25) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 46 smd rect (at -4.3 1.75) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 47 smd rect (at -4.3 2.25) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
(pad 48 smd rect (at -4.3 2.75) (size 1.4 0.254) (layers F.Cu F.Paste F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.01))
)
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