OSHW-DEIMOS/HARDWARE/A64-TERES/KiCad/Footprints.old/OLIMEX_Connectors-FP.pretty/UEXTF.kicad_mod
2018-05-30 18:14:28 -07:00

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(module UEXTF (layer F.Cu) (tedit 553F7CF4)
(attr smd)
(fp_text reference P3 (at 4.064 7.366) (layer F.SilkS)
(effects (font (size 1.016 0.762) (thickness 0.0635)))
)
(fp_text value HE10-10 (at 0 -3.81) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 2.54 -6.35) (end 2.54 6.35) (layer F.Fab) (width 0.15))
(fp_line (start -3.81 -1.27) (end -2.54 -1.27) (layer F.Fab) (width 0.15))
(fp_line (start -2.54 -1.27) (end 1.27 -1.27) (layer F.Fab) (width 0.15))
(fp_line (start 1.27 -1.27) (end 1.27 1.27) (layer F.Fab) (width 0.15))
(fp_line (start 1.27 1.27) (end -3.81 1.27) (layer F.Fab) (width 0.15))
(fp_line (start 2.54 -6.35) (end -3.81 -6.35) (layer F.Fab) (width 0.15))
(fp_line (start -3.81 -6.35) (end -3.81 6.35) (layer F.Fab) (width 0.15))
(fp_line (start -3.81 6.35) (end 2.54 6.35) (layer F.Fab) (width 0.15))
(pad 1 smd rect (at 5.08 -5.08) (size 5.08 1.524) (layers F.Cu F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 2 smd rect (at 5.08 -5.08) (size 5.08 1.524) (layers B.Cu B.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 3 smd rect (at 5.08 -2.54) (size 5.08 1.524) (layers F.Cu F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 4 smd rect (at 5.08 -2.54) (size 5.08 1.524) (layers B.Cu B.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 5 smd rect (at 5.08 0) (size 5.08 1.524) (layers F.Cu F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 6 smd rect (at 5.08 0) (size 5.08 1.524) (layers B.Cu B.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 7 smd rect (at 5.08 2.54) (size 5.08 1.524) (layers F.Cu F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 8 smd rect (at 5.08 2.54) (size 5.08 1.524) (layers B.Cu B.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 9 smd rect (at 5.08 5.08) (size 5.08 1.524) (layers F.Cu F.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
(pad 10 smd rect (at 5.08 5.08) (size 5.08 1.524) (layers B.Cu B.Mask)
(solder_mask_margin 0.0508) (solder_paste_margin -0.0508) (clearance 0.0508))
)